Surface Mount Technology
Today's electronics manufacturing environment is a changing landscape of new component types and shrinking package sizes.
Surface mount technology reduces costs and cycle time through an automated assembly process that also reduces the size and weight of a product by up to 75%. Through the SMT process, parts can be installed on both sides of the board, increasing functionality without increasing board size, and closer spacing of parts is achieved, meeting the demands of high speed or low impedance circuits. Additionally, surface mount component packages are generally less expensive than their through hole counterparts.
To keep up with new technology, Precise utilizes flexible placement machines to navigate even the toughest requirements such as BGA, uBGA, leadless devices, and 0201 components. Our SMT equipment is capable of placing up to 45,000 parts per hour, and our reflow ovens have nine forced convection zones for precision profiling. We offer our customers both no-clean and aqueous clean processes in tin-lead and RoHS applications.
Precise Connections is a proud member of the Dallas Chapter of the Surface Mount Technology Association.
To learn more about our capabilities and processes, please contact us.